PPI at Bondexpo 2019

We would like to welcome you at our stand at Bondexpo 2019 - the worldwide number one user meeting place. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
You will find us at Stand 6435 in Hall 6.