Heat Activated Tapes for Dual Interface Chip Bonding
When manufacturing Dual Interface or Non-contacted Cards, many manufacturers use the conductive paste to bond the flip chip.
Using electrically conductive heat-activated films (or anisotropic conductive films - ACF) for bonding the chip module, PPI Adhesive Products offers an alternative to the paste or glue, reducing the processes involved in manufacturing and thus increasing efficiency.
Our conductive heat-activated tapes offer potentially higher productivity than conductive glue or paste, ensuring a secure connection of the antenna and chip module, and providing you with higher flexibility.
RD – 1054B/ RD – 1054C these products have a stable conductivity based on an electrically conductive thermoplastic adhesive supplied on a siliconised paper interliner. The products are colourless and suitable for bonding PVC & ABS materials.
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Product Categories
Mounting and Laminating |
Adhesive Bonding |
Industries
Smart Cards Industry |